Chipboard (P5) - return element

The MFP system boards are used as a load-bearing element for underfloor heating pipes in dry construction. The physical properties of MFP boards ensure the best possible load-bearing capacity of the floor. These are dedicated for mounting onto joist floors. The boards are available in different configurations depending on the technical conditions of a given investment. A necessary additional element for the board is a properly profiled aluminum plate, which is a heat sink as well as collector of the heat from the side of the pipe and evenly distribute it over the plate surface.

Technical data

• Density (kg/m³): ≥ 650
• Declared heat transfer coefficient λ (W/mK): 0.12
• Particularly high load capacity and bending strength
• Outstanding stability
• Isotropic longitudinal and transverse strength
• Approval by building supervision in accordance with CE EN 13986
• The material used is PEFC™ and FSC® certified
• Fire resistance class (DIN 4102/EN13986)

* Boards available only for an customer request